首页> 外国专利> DIAMOND AND CUBIC BORON NITRIDE ABRASIVE COMPACTS USING SIZE SELECTIVE ABRASIVE PARTICLE LAYERS

DIAMOND AND CUBIC BORON NITRIDE ABRASIVE COMPACTS USING SIZE SELECTIVE ABRASIVE PARTICLE LAYERS

机译:使用尺寸选择磨料颗粒层的金刚石和立方氮化硼磨料

摘要

Disclosed is an improved process for preparing a composite compact wherein a mass of abrasive crystals, a mass of metal carbide, and a bonding medium are subjected to a high-temperature/high pressure process for providing a composite compact. The sintered carbide mass supports the mass of abrasive crystals and bonding or catalyst metal, and the abrasive crystal grains are directly bonded to adjacent crystal grains in the mass thereof. Such improved process comprises disposing the mass of abrasive crystals in layers wherein the coarsest layer is closest to the carbide mass and is composed of crystals having a largest dimension of between about 75 and 500 microns and the finest layer is disposed farthest away in the carbide mass and is composed of crystals having a largest dimension of less than 10 microns. The abrasive crystals are selected from the group consisting of diamond and cubic boron nitride and preferably are diamond; the metal carbide preferably is tungsten carbide; and the bonding metal preferably is cobalt. The resulting improved composite compact also is disclosed.
机译:公开了一种用于制备复合压块的改进方法,其中将大量的磨料晶体,大量的金属碳化物和粘结介质进行高温/高压处理以提供复合压块。烧结的碳化物块支撑磨料晶体和粘结或催化剂金属的块,并且磨料晶粒直接与其中的相邻晶粒粘结。这种改进的方法包括将磨料晶体块布置在层中,其中最粗糙的层最接近碳化物块,并且由最大尺寸在约75至500微米之间的晶体组成,而最细的层布置在碳化物块中最远的位置。并且由最大尺寸小于10微米的晶体组成。磨料晶体选自金刚石和立方氮化硼,优选为金刚石;优选为金刚石。金属碳化物优选为碳化钨。结合金属优选为钴。还公开了所得的改进的复合压块。

著录项

  • 公开/公告号IE52867B1

    专利类型

  • 公开/公告日1988-03-30

    原文格式PDF

  • 申请/专利权人 GENERAL ELECTRIC COMP.;

    申请/专利号IE19810003009

  • 发明设计人

    申请日1981-12-21

  • 分类号B01J3/06;B24D3/08;

  • 国家 IE

  • 入库时间 2022-08-22 06:59:57

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