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Compression-moulding resin compound, and compression-moulded electronic component
Compression-moulding resin compound, and compression-moulded electronic component
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机译:压缩成型树脂化合物和压缩成型电子部件
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摘要
The compression-moulding resin compound of this invention contains a resin containing a release agent formed from a release agent and a metal chelate compound. This resin compound has improved, good adhesion, high moisture resistance and good mouldability.
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