Method of bonding columbium to nickel and nickel based alloys using low bonding pressures and temperatures

摘要

The disclosure relates to a method of joining nickel and nickel based alloys to columbium at low pressure and low temperature, wherein a thin titanium brazing foil is provided, with or without a copper coating electroplated thereon. The layers or foils of the metals to be joined are placed in intimate contact with opposite sides of the brazing foil under pressure and heated in a vacuum to a temperature above the eutectic of the metals being used and below 2000° F. and preferably below 1950. degree. F. to provide the bond.