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Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating
Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating
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机译:形成具有优异机械性能的铜涂层的方法以及具有由该铜涂层形成的导体图案的印刷线路板
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摘要
A process of forming on a substrate a copper coating which has excellent mechanical properties, comprising depositing copper on the substrate by chemical plating, and forming at least one silver-rich layer during the deposition of copper, each silver-rich layer has a higher content of silver than the other portion of the copper coating. Also disclosed is a process of producing a printed-wiring board by forming such a copper coating.
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