METHOD AND APPARATUS FOR INSPECTING SHORTCIRCUIT FAILURE AND SHORTCIRCUIT FAILURE REPAIRING APPARATUS

摘要

PURPOSE:To obtain a method for inspecting a failure capable of performing two-dimensional detection and the apparatus for executing said method, by generating heat in a part where the shortcircuit of conductor patterns is generated and detecting the infrared rays emitted from the heat generating part by an infrared camera. CONSTITUTION:Probes 1a, 1b are allowed to begin to move along one end of the conductor patterns 8 of a liquid crystal glass substrate 7 by a moving mechanism 3. Voltage of 5V is applied to the probes 1a, 1b. When said probes 1a reach a place where conductor patterns 8a, 8b are shortcircuited, a current flows between the patterns 8a, 8b through the shortcircuited part. When this current flows, a control part 6 stops the moving mechanism 3 at that position and the voltage of a power supply 2 is changed over to apply voltage of 40V to the probes 1a, 1b. Hereupon, an infrared camera 4 takes the image of the patterns 8. Since the shortcircuited part has a high resistance value, the generation quantity of heat therefrom exceeds that of the conductor paths of the patterns 8. The infrared rays emitted at the time of the generation of heat are imaged by the camera 4 to be displayed on a monitor 5.