ALUMINUM COMPOSITE MATERIAL COMBINING LOW THERMAL EXPANSION PROPERTY WITH HIGH HEAT DISSIPATION PROPERTY

摘要

PURPOSE:To manufacture an Al composite alloy suitable for radiating substrate for semiconductor device, by incorporating specific amounts of powder, etc., selected from those of AlN, SiC, BN, and graphite to Al and regulating the thermal expansion coefficient and thermal conductivity of the resulting alloy to specific values, respectively. CONSTITUTION:An Al composite alloy which has a composition consisting of 30-70vol.% of at least one kind among the powder (10mu average diameter), short fiber, and whisker selected from those of AlN, SiC, BN, and graphite and the balance essentially Al and in which thermal expansion coefficient at a temp. in the vicinity of ordinary temp. and thermal conductivity are regulated to 5-11X10-6/ deg.C and 0.1-0.3cal/cm.sec. deg.C, respectively, is prepared. By this method, the inexpensive Al composite alloy combining a thermal expansion coefficient equal to that of semiconductor material with a high thermal conductivity can be obtained.