For the automatic laying of fine wires encased in hot-melt adhesive onto component circuit boards, it is necessary to have the possibility, during the laying operation, of pulling the wire off from a supply loop approximately free of friction and inertia. For this, according to the invention, after a wire supply reel there is a loop chamber which is subjected to compressed air and has a tracer device and which cuts off the air stream after a specific loop size has been reached. IMAGE
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