首页> 外国专利> Hard Polyurethane Modified Polyisocyanurate Substrates and Laminate Composites of Metals, Plastics, Cellulose, Glass, Ceramics, or Mixtures thereof, Methods for Making and Circuit Boards

Hard Polyurethane Modified Polyisocyanurate Substrates and Laminate Composites of Metals, Plastics, Cellulose, Glass, Ceramics, or Mixtures thereof, Methods for Making and Circuit Boards

机译:金属,塑料,纤维素,玻璃,陶瓷或它们的混合物的硬质聚氨酯改性的聚异氰脲酸酯基质和层压复合材料,制造方法和电路板

摘要

Laminated composites including method for the preparation thereof comprising forming in combination in a mold at least one layer of a rigid polyurethane modified polyisocyanurate by reacting in said mold, a reaction mixture of an organic di- or polyisocyanate, a cyclic alkylene carbonate and a polyether polyol in the presence of a soluble adduct amine-carbonate catalyst, and at least one layer of material selected from metal, plastic, cellulose, glass and ceramic or combinations thereof. The electrically conductive "metal clad" laminates are especially useful as printed circuit boards.
机译:层压复合材料,包括其制备方法,该方法包括在模具中通过在模具中反应形成至少一层刚性聚氨酯改性的聚异氰脲酸酯,有机二或多异氰酸酯,环状碳酸亚烷基酯和聚醚多元醇的反应混合物。在可溶性加合物胺-碳酸盐催化剂和至少一层选自金属,塑料,纤维素,玻璃和陶瓷或其组合的材料的存在下。导电的“金属包覆的”层压板特别用作印刷电路板。

著录项

  • 公开/公告号KR890004598A

    专利类型

  • 公开/公告日1989-04-22

    原文格式PDF

  • 申请/专利权人 해이 다불류 길 쥬니어;

    申请/专利号KR1019880010732

  • 发明设计人 우사마 이이 요우네즈;

    申请日1988-08-23

  • 分类号H05K3/00;

  • 国家 KR

  • 入库时间 2022-08-22 06:33:24

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