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Hard Polyurethane Modified Polyisocyanurate Substrates and Laminate Composites of Metals, Plastics, Cellulose, Glass, Ceramics, or Mixtures thereof, Methods for Making and Circuit Boards
Hard Polyurethane Modified Polyisocyanurate Substrates and Laminate Composites of Metals, Plastics, Cellulose, Glass, Ceramics, or Mixtures thereof, Methods for Making and Circuit Boards
Laminated composites including method for the preparation thereof comprising forming in combination in a mold at least one layer of a rigid polyurethane modified polyisocyanurate by reacting in said mold, a reaction mixture of an organic di- or polyisocyanate, a cyclic alkylene carbonate and a polyether polyol in the presence of a soluble adduct amine-carbonate catalyst, and at least one layer of material selected from metal, plastic, cellulose, glass and ceramic or combinations thereof. The electrically conductive "metal clad" laminates are especially useful as printed circuit boards.
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