首页> 外国专利> PROCESS FOR PRODUCING A SINTERED SILICON CARBIDE/CARBON COMPOSITE CERAMIC BODY HAVING ULTRAFINE GRAIN MICROSTRUCTURE

PROCESS FOR PRODUCING A SINTERED SILICON CARBIDE/CARBON COMPOSITE CERAMIC BODY HAVING ULTRAFINE GRAIN MICROSTRUCTURE

机译:具有超细晶粒组织的碳化硅/碳复合陶瓷烧结体的制备方法

摘要

Sintered silicon carbide/carbon composite ceramic body having a homogeneous very fine grain microstructure with at least 50 percent of its silicon carbide grains having a size not exceeding about 5 microns and an aspect ratio less than about 3, with graphite grains having an average size not exceeding that of the silicon carbide grains uniformly dispersed throughout the matrix of silicon carbide and having a density of at least 75 percent of theoretical can be made by firing of an infiltrated, microporous shaped green body having prior to infiltration a density of at least about 45 percent of theoretical, the shaped green body being infiltrated with an organic material which can be coked at elevated temperatures to form carbon, a sintering aid selected from the group consisting of aluminum, beryllium or boron or compounds containing any one or more of these or a mixture of any of the foregoing elements or compounds, silicon carbide having a surface area of from about 5 to about 100 square meters/gram and, optionally, a temporary binder at a sintering temperature of from about 1900 DEG C to about 2300 DEG C in an inert atmosphere or vacuum. The process for making such pressureless-sintered composite bodies is relatively undemanding of exact temperature/time control during sintering. Certain embodiments of such composite sintered bodies may be electrical-discharge machined. Fully dense composite bodies exhibiting no open porosity may be formed.
机译:具有均匀的非常细的晶粒微观结构的碳化硅/碳复合陶瓷烧结体,其碳化硅晶粒的至少50%的尺寸不超过约5微米,长径比小于约3,石墨晶粒的平均尺寸不超过可以通过烧制一种渗透的,微孔形状的生坯,使碳化物的颗粒超过均匀分布在整个碳化硅基体中且密度为理论值的至少75%的碳化硅晶粒,其烧结前的密度至少为约45百分比的理论值,成型的生坯浸入可以在高温下焦化以形成碳的有机材料,一种选自铝,铍或硼的烧结助剂或含有这些中的任何一种或多种的化合物,或任何上述元素或化合物的混合物,碳化硅的表面积约为5至100平方是米/克,并且任选地是在惰性气氛或真空中在约1900℃至约2300℃的烧结温度下的临时粘合剂。制备这种无压烧结的复合体的方法相对不需要烧结期间精确的温度/时间控制。这种复合烧结体的某些实施例可以进行放电加工。可能会形成没有开孔的完全致密的复合体。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号