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Measuring device for determining the temperature of half conductor bodies, a method for the production of the measuring device and method for determining the temperature of half conductor bodies during tempering processes

机译：用于确定半导体的温度的测量装置，该测量装置的制造方法以及在回火过程中确定半导体的温度的方法

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公开/公告号DE3715231A1

专利类型
公开/公告日1988-11-17

原文格式PDF
申请/专利权人 SIEMENS AG 1000 BERLIN UND 8000 MÜNCHEN DE;
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申请/专利号DE19873715231
发明设计人 TEWS HELMUT DIPL.-PHYS. DR. 8025 UNTERHACHING DE;ZWICKNAGL PETER DIPL.-PHYS. DR. 7000 STUTTGART DE;GISDAKIS SPYRIDON DIPL.-PHYS. 8000 MÜNCHEN DE;
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申请日1987-05-07
分类号G01K7/02;H01L21/324;H01L21/66;
国家 DE
入库时间 2022-08-22 06:31:19

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