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Method for the production of sintered electrical contact material for low voltage power switching

机译:低压功率开关用烧结电触头材料的生产方法

摘要

Contact materials based on AgSnO.sub.2 and having Bi.sub.2 O. sub.3 and CuO as further metal oxide additives were previously disclosed. In these materials the total content of all metal oxides was supposed to be between 10 and 25% by volume with the SnO.sub.2 share equal to or greater than 70% by volume of the total amount of oxide.PP According to this invention the quantity of SnO.sub.2 is kept smaller than 70% by volume; specifically at about 65%, but in any case equal to or greater than 50%. The SnO.sub.2 weight content is to be in the 4% to 8% range and the weight percentage ratio of SnO.sub.2 to CuO is to be between 8:1 and 12:1.PPIn the associated production process, either Bi.sub.2 O.sub.3 powder is purposely admixed to an internally oxidized alloy powder (IOAP) in an additional operation, a grain restructuring with locally different Bi.sub.2 O.sub.3 concentrations occurring in the structure after sintering and compacting. Alternatively, higher bismuth percentages in the alloy powder can be worked with directly, which is again internally oxidized to an IOAP. From these starting materials two-layer sintered contact elements with a solderable silver layer can be efficiently produced.
机译:先前公开了基于AgSnO 2且具有Bi 2 O 3和CuO作为其他金属氧化物添加剂的接触材料。在这些材料中,所有金属氧化物的总含量应在10%至25%(体积)之间,而SnO2的份额应等于或大于氧化物总量的70%(体积)。 >根据本发明,SnO 2的量保持小于70体积%。具体来说约为65%,但无论如何等于或大于50%。 SnO2的重量含量应在4%至8%的范围内,SnO2与CuO的重量百分比应在8:1至12:1之间。

在相关的生产过程中,在额外的操作中,将Bi 2 O 3粉末故意掺入内部氧化的合金粉末(IOAP)中,用局部不同的Bi 2 O 2进行晶粒重构。烧结和压实后结构中出现3种浓度。或者,可以直接处理合金粉末中较高的铋含量,然后再将其内部氧化为IOAP。由这些原料可以有效地生产具有可焊银层的两层烧结接触元件。

著录项

  • 公开/公告号US4855104A

    专利类型

  • 公开/公告日1989-08-08

    原文格式PDF

  • 申请/专利权人 SIEMENS AKTIENGESELLSCHAFT;

    申请/专利号US19880190804

  • 发明设计人 BERNHARD ROTHKEGEL;WOLFGANG HAUFE;

    申请日1988-05-06

  • 分类号B22F3/24;

  • 国家 US

  • 入库时间 2022-08-22 06:27:41

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