CU ALLOY STOCK FOR LEAD FRAME OF SEMICONDUCTOR DEVICE HAVING EXCELLENT EFFECT OF SUPPRESSING WEAR IN STAMPING DIE

摘要

PURPOSE:To improve the effect of suppressing wear in a die and to prolong its service life by adding specified amounts of Mg, Ca, Zn, etc., to a conventionally used Cu alloy as the stock for a die used at the time of stamping a lead frame in a semiconductor device. CONSTITUTION:As the stock for a die used at the time of manufacturing a lead frame used in the manufacturing of various semiconductor devices from its sheet material or wire material by stamping, a Cu alloy of which one or more kinds among, by weight, 0.001 to 0.05% Mg, 0.001 to 0.01 % Ca and 0.001 to 1% Zn are further added to a Cu alloy contg. 0.05 to 0.25% Fe, 0.015 to 0.07% P and 0.0005 to 0.01% Pb is used. The effect of suppressing wear in the die is made excellent, so that the die having prolonged service life can be obtd.