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STYRYLOXY RESIN UNDERGOING CATIONK POLYMERIZATION, POLYMERIZABLE COMPOSITION FORMED THEREFROM, CROSSLINKED POLYMER OF SAID RESIN AND METHOD OF CURING SAID RESIN
STYRYLOXY RESIN UNDERGOING CATIONK POLYMERIZATION, POLYMERIZABLE COMPOSITION FORMED THEREFROM, CROSSLINKED POLYMER OF SAID RESIN AND METHOD OF CURING SAID RESIN
Cationically polymerisable styryloxy resins having urethane linkages, represented by the formula III CHEM wherein R1 and R2 are H, or one of R1 and R2 is H and the other is methyl; R3 and R4 (which may be the same or different) are H, lower alkyl, or alkoxy if R2 is not methyl; R5 is a divalent hydrocarbon radical; G1 is an n-valent hydrocarbon radical free of amino, aliphatic thiol, aliphatic hydroxyl or other groups which interfere with cationic polymerisation; and n is an integer of 2 or more. G1 is a hydrocarbon backbone which is not interrupted by a hetero atom. Preferably G1 is a residue of a diene homopolymer or copolymer, in which case the resins produce flexible polymers. The resins are polymerised with a cationic polymerisation initiator or latent acid catalyst. The resins have utility in the field of electronics.
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机译:由式III 表示的具有氨基甲酸酯键的可阳离子聚合的苯乙烯氧基树脂,其中R 1和R 2为H,或R 1和R 2中的一个为H,另一个为甲基。如果R 2不是甲基,则R 3和R 4(可以相同或不同)为H,低级烷基或烷氧基。 R 5为二价烃基。 G 1是不含氨基,脂族硫醇,脂族羟基或其他干扰阳离子聚合的基团的n价烃基; n为2以上的整数。 G 1是未被杂原子中断的烃骨架。优选地,G 1是二烯均聚物或共聚物的残基,在这种情况下,树脂产生柔性聚合物。用阳离子聚合引发剂或潜酸催化剂使树脂聚合。树脂在电子领域具有用途。
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