PURPOSE:To adjust and stabilize easily the thickness distribution of the thin film on a substrate in a sputtering device provided with a pair of targets disposed in parallel by providing plate members having a specific shape to the top end on the substrate side of shielding covers for targets. CONSTITUTION:A pair of the targets T1, T2 are disposed at a specified spacing in a vacuum vessel 10 and the thin film consisting of the target materials is formed on the long-sized substrate 40 which is transferred while the side part thereof is curved in a direction MD. Permanent magnets 152, 162 are disposed on the rear of the targets T1, T2 to generate a magnetic field thus forming sputtered particles in the form of a thin film on the substrate 40 surface. The shielding covers 17, 18 are respectively attached to the outside of the targets T1, T2 and the plate member P1, P2 forming projecting parts of a prescribed pattern to the substrate side end faces of said covers are attached to the covers. The plasma region toward the substrate 40 in the central part and the diffusion of the sputtered particles are thereby limited by which the film forming speed in the transverse direction of the substrate 40 is made uniform and the thickness of the formed film is made uniform and adjustable.
展开▼
