PURPOSE:To obtain a material which is more inexpensive than phosphor bronze, is comparable to the bronze in mechanical strength and repeated bending properties, has relatively high electric conductivity and is suitable for electrical appliances, chiefly a semiconductor frame by adding a specified percentage each of Sn, P and Ni to Cu. CONSTITUTION:This Cu alloy consists of, by weight, 1.7-2.5% Sn, 0.03-0.35% P, 0.1-0.6% Ni and the balance Cu with inevitable impurities. The lower limit of Sn is the minimum amount required to obtain generally ideal strength level and elongation in consideration of the effect of added Ni, and the upper limit is restricted from the cost and electric condutivity. Ni makes the grains of the Cu- Sn alloy fine within said range, the lower limit is the amount required to enhance the strength, and the upper limit is restricted from the cost. The lower limit of P is the amount required to produce a deoxidation effect, and the upper limit is restricted from the electric conductivity.
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