PURPOSE:To manufacture a copper alloy excellent in bendability, solderability, heat resistance, etc., as well as in strength and conductivity, by incorporating Ti and Si to copper in specific amounts and ratios and by forming the prescribed alloy structure. CONSTITUTION:This copper alloy has a composition consisting of, by weight, 0.1-3.0% Ti, 0.03-1.5% Si, and the balance Cu and satisfying Ti/Si=2-4 and also has a structure in which Ti-Si intermetallic compounds are dispersedly precipitated in a Cu matrix. In order to manufacture this copper alloy, a slab of the above composition is first prepared by melting and casting, which is hot-rolled at =800 deg.C finishing temp. of hot rolling at =60% draft and is then cooled from the above finishing temp. of hot rolling down to =250 deg.C at a rate of =30 deg.C/min so as to be formed into a hot-rolled plate. This hot-rolled plate is subjected to cold rolling at =50% draft and then to annealing at 300-600 deg.C for 5-720min. The resulting annealed stock is subjected to thickness reduction to the desired thickness by cold rolling and, after the final cold rolling, the cold-rolled sheet is subjected to tension annealing at 300-750 deg.C for 5-180sec.
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