PURPOSE:To prevent the generation of bubbles in case of bonding by forming the layer of resin for bonding diluted by a solvent to the surface of a solid-state image sensing element or the surface of a filter. CONSTITUTION:The resin for bonding diluted by the low-melting point organic solvent up to ICPS or lower is dropped to the surface of the solid-state image sensing element 31, and the unevenness of the surface of the solid-state image sensing element 31 is coated with the resin layer 32. The surface is thermally treated in an extent that the resin layer 32 is not cured, and a resin layer having viscosity required for bonding is left through the evaporation of the solvent. The resin layer 33 is also formed onto the color filter 34 through the same process, the solid-state image sensing element 31 and the color filter 34 are mutually positioned and stacked, and both are bonded and fixed by the resin layers 32, 33. Since the resin diluted by the solvent is used, a resin liquid also intrudes to the small unevenness of the surfaces of the solid-state image sensing element and the color filter, and the generation of bubbles is reduced extremely.
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