首页> 外国专利> NONPOWER SOURCE PLATING METHOD UTILIZING POTENTIAL DIFFERENCE DUE TO EARTHING

NONPOWER SOURCE PLATING METHOD UTILIZING POTENTIAL DIFFERENCE DUE TO EARTHING

机译:利用地球电位差来进行非能源源定位的方法

摘要

PURPOSE:To apply the titled plating with excellent antirust property at a low cost by a method wherein, among two or more kinds of metals, a metal high in ionization tendency is inserted into a plating bath in an earthed condition and a metal low in ionization tendency is suspended into the plating bath. CONSTITUTION:In a plating bath tank 5, a metal 1 high in ionization tendency and a plating bath liquid 8 containing a same kind of ion are entered. The metal 1 earthed to a position 7 by connecting to a lead wire 6 is immersed in said liquid 8. A metal 2 low in ionization tendency is suspended from a support rod 4 by hooking to a hanger 3 made of aluminum or a resin to be immersed in said liquid 8. Further, a metal same to the metal 1 is immersed in said liquid 8 without earthing. This metal is reacted with the liquid 8 to generate hydrogen and, by a gas bubble stream 8' of said hydrogen, electric double layer on a surface of the metals 1, 2 is removed.
机译:用途:以低成本通过以下方法应用具有优异防锈性能的标题镀层的方法:在两种或多种金属中,将离子化趋势高的金属在接地状态下插入电镀液中,将离子化程度低的金属插入趋势被悬浮在电镀液中。构成:在镀浴槽5中,加入了具有高电离趋势的金属1和含有相同离子的镀浴液8。通过连接到导线6接地到位置7的金属1浸入到所述液体8中。通过钩挂到由铝或树脂制成的悬挂器3上,将离子化趋势低的金属2从支撑杆4悬挂下来。浸没在所述液体8中。此外,与金属1相同的金属浸入所述液体8中而不接地。该金属与液体8反应产生氢气,并通过所述氢气的气泡流8'除去金属1、2表面上的双电层。

著录项

  • 公开/公告号JPH021234B2

    专利类型

  • 公开/公告日1990-01-10

    原文格式PDF

  • 申请/专利权人 FUJIMORI KOJI;FUJIMORI KEIKO;

    申请/专利号JP19800112744

  • 发明设计人 FUJIMORI KOJI;FUJIMORI KEIKO;

    申请日1980-08-18

  • 分类号C23C18/54;

  • 国家 JP

  • 入库时间 2022-08-22 06:21:04

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号