In a sputtering operation wherein a plasma is formed between a cathode/target and an anode, the cathode/target is moved relative to the plasma so that a portion thereof is within the plasma while another contiguous portion is outside the plasma. The cathode/target may be provided as a moving ribbon 10. Alternatively the cathode/target may be a rotating drum or disk, passing through the active plasma or a rod fed into the active plasma. The target has extended life. Improved cooling is also achieved by providing cooling means 35 in addition to cooling structure 15. IMAGE
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