PROCEDURE AND APPARATUS FOR CHECKING THE CUT PROCEDURE BY SEPARATION OF DISCS FROM NON-MAGNETIZABLE WORKING TOPICS

摘要

During the cutting-off of wafers from work pieces, such as, for example, semiconductor rods, the control of saw blade excursions in the interior of the work piece is important. According to the invention, a magnetic continuous field passing through the wafer to be cut off is built up for this purpose between a fixed measuring unit and the cutting-off tool, which continuous field changes in the event of deviations of the cutting-off tool from the desired line of cut. By measuring, for example, the resulting force of attraction, the change can be detected and the cutting-off tool can be brought back into the desired direction by control adjustment. In this way, wafers having excellent flatness are obtained. …IMAGE…