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Surface mount technology breakaway self regulating temperature heater

机译:表面贴装技术突破性的自调节温度加热器

摘要

Soldering of surface mount connector terminals to contact pads (41) on circuit board (40) is facilitated by configuring the terminals (33) and their solder tails (39) as spaced integrally-formed projections of a selectively actuable heater. Thermal energy developed in the heater(35) is conducted along the projections to the solder tails (39) to melt fusible conductive material (e.g., solder, at the connection sites). After cooling, the projections are severed from the heater (35). The terminals (33), which are formed at the distal ends of the projections, are typically supplied partially inserted in respective terminal-­receiving passages (31) of the connector housing (30). After the soldering operation, the terminals (33) are fully inserted into the passages (31). The heater (35) is preferably a self-regulating heater in the form of a copper substrate having a skin layer (13) of magnetically permeable, high resistance material. An alternating current of constant amplitude and high frequency is passed through the heater (35) and concentrated in the skin layer (13) at temperatures below the Curie temperature of the skin layer material. At higher temperatures, the current is distributed through the lower resistance substrate to limit further heating. During the time interval required for the surface layer (13) to reach its Curie temperature, the resistive power dissipation creates thermal energy that is conducted to the solder tails (39).
机译:通过将端子(33)和它们的焊尾(39)配置为可选择性地致动的加热器的间隔的整体形成的突起,有助于将表面安装连接器端子焊接到电路板(40)上的接触垫(41)。加热器(35)中产生的热能沿着突起传导到焊尾(39),以熔化可熔的导电材料(例如,在连接位置处的焊锡)。冷却后,将突起从加热器(35)上割下。形成在突出部的远端处的端子(33)通常被供应为部分地插入连接器壳体(30)的各个端子容纳通道(31)中。在焊接操作之后,端子(33)完全插入通道(31)中。加热器(35)优选地是具有铜基片形式的自调节加热器,该铜基片具有由导磁的高电阻材料制成的表皮层(13)。具有恒定幅度和高频的交流电通过加热器(35),并在低于表层材料的居里温度的温度下集中在表层(13)中。在较高温度下,电流分布在较低电阻的基板上,以限制进一步的加热。在表面层(13)达到其居里温度所需的时间间隔内,电阻功率耗散产生热能,该热能被传导到焊尾(39)。

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