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An improved method for forming emitters in a bicmos process

机译:一种在双峰工艺中形成发射极的改进方法

摘要

A bipolar transistor and method of making the same is disclosed. The transistor has an emitter region (89) which is diffused from polysilicon (69e) into the intrinsic base region (61), where the polysilicon (69e) is doped with two dopant species of different diffusivity. The impurity concentration of the higher diffusivity species, for example phosphorous, can be selected to define the emitter junction depth, which is preferably shallow, while the impurity concentration of the lower diffusivity species, for example arsenic, can be selected to provide a high conductivity emitter electrode (69e), as well as reduce the sensitivity of the emitter electrode (69e) to counterdoping from the implantation of the extrinsic base region (86). The structure is compatible with BiCMOS processing, as the same anneal can be used to diffuse the emitter (89) and the source/drains (74, 84) of the MOS transistors, with the emitter junction depth optimized via the implant conditions of the higher diffusivity species. The emitter electrode (69e) according to the invention can also be exposed to the opposite conductivity type source/drain implant, with reduced sensitivity to counterdoping.
机译:公开了一种双极晶体管及其制造方法。该晶体管具有从多晶硅(69e)扩散到本征基极区(61)的发射极区(89),其中多晶硅(69e)掺杂有两种扩散率不同的掺杂剂。可以选择较高扩散率种类(例如磷)的杂质浓度来定义发射极结深度,该深度最好浅些,而可以选择较低扩散率种类(例如砷)的杂质浓度来提供高导电率发射极电极(69e),以及降低发射极电极(69e)对来自非本征基极区(86)的注入的反掺杂的敏感性。该结构与BiCMOS处理兼容,因为相同的退火可用于扩散MOS晶体管的发射极(89)和源极/漏极(74、84),且发射极结深度可通过较高的注入条件进行优化扩散物种。根据本发明的发射电极(69e)也可以暴露于相反导电类型的源极/漏极植入物,同时降低了对反掺杂的敏感性。

著录项

  • 公开/公告号EP0381071A2

    专利类型

  • 公开/公告日1990-08-08

    原文格式PDF

  • 申请/专利权人 TEXAS INSTRUMENTS INCORPORATED;

    申请/专利号EP19900101582

  • 发明设计人 EKLUND ROBERT H.;

    申请日1990-01-26

  • 分类号H01L21/22;H01L21/225;H01L21/82;

  • 国家 EP

  • 入库时间 2022-08-22 06:13:20

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