首页> 外国专利> Method for preparing a monocrystalline layer, consisting of a first semiconducting material, on a substrate composed of a different-type second semiconducting material, and use of the arrangement for fabricating optoelectronic integrated circuits

Method for preparing a monocrystalline layer, consisting of a first semiconducting material, on a substrate composed of a different-type second semiconducting material, and use of the arrangement for fabricating optoelectronic integrated circuits

机译:在由不同类型的第二半导体材料构成的基板上制备由第一半导体材料构成的单晶层的方法,以及该装置在制造光电集成电路中的用途

摘要

In order to prepare a monocrystallline layer (3), consisting of a first semiconducting material, e.g. silicon, on a substrate (1) of a different type of second semiconductor material, e.g. of an AIIIBV compound, the layer (3) of the first semiconductor material is first applied in amorphous or polycrystalline form to the substrate (1) and is then transformed, with the aid of a lateral recrystallisation process, e.g. by laser light (4), into a monocrystalline layer (3). In this process, the substrate (1) may contain patterns of insulating material (2), e.g. insulation oxides (2) for separating (segregating) the active components. The method is suitable for fabricating optoelectronic integrated circuits on the basis of AIIIBV compounds in combination with silicon. IMAGE
机译:为了制备单晶层(3),该单晶层由第一半导体材料例如铝制成。硅在不同类型的第二半导体材料(例如首先,将第一半导体材料的层(3)以无定形或多晶形式施加到衬底(1)上,然后借助于横向重结晶过程例如通过重结晶来进行转化。通过激光(4)进入单晶层(3)。在该过程中,基板(1)可以包含例如绝缘材料(2)的图案。用于分离(分离)活性成分的绝缘氧化物(2)。该方法适合于基于与硅结合的AIIIBV化合物制造光电集成电路。 <图像>

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