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Method of reproducing images from a photocopiable master pattern onto solid materials having a degree of malleability; particular application for the printing of electrical circuit patterns onto the copper of boards intended for printed circuits
Method of reproducing images from a photocopiable master pattern onto solid materials having a degree of malleability; particular application for the printing of electrical circuit patterns onto the copper of boards intended for printed circuits
The invention relates to a method of reproducing images from a photocopiable master pattern onto solid materials having a degree of malleability. One particular application is the printing of electrical circuit patterns onto the copper of boards of printed circuits. The system consists of a modified powder photocopier, the latter forming the image on the transfer system. The latter is a closed circuit produced as a sheet, the essential characteristic of which is that of being highly resistant to compression and to penetration. The transfer system, during its contact with the board, prints the circuit pattern into the copper due to the force exerted by the compression system. This device is particularly suited to the printing of electrical circuit patterns onto boards intended for printed circuits.
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