Electronic module comprising a first substrate element with a functional part, and a second substrate element for testing an interconnection function, socket, substrate element and electronic apparatus therefor

摘要

An electronic, digital IC module includes a substrate element on which is formed a test integrated circuit for the execution of a boundary scan on a standard integrated circuit formed on another substrate element. Either the substrate for the test circuit is provided in an electronic sub-module on which is formed a test socket, in which case the standard circuit is mounted piggy-back, or a hybrid package is provided composed of the two substrate elements which are interconnected by bond pads. The test circuit includes a shift register for parallel connection to the standard circuit and serial connection to an external test unit.