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CONTINUOUS TREATMENT APPARATUS AND POSTERIOR TREATMENT

机译:连续治疗仪和后路治疗

摘要

PURPOSE:To increase a corrosion-resistant performance of an Al-based interconnection film and a laminated structure interconnection film by a method wherein, after a dry etching treatment of the Al-based interconnection film and the laminated interconnection film, a posterior treatment which is composed of an ashing treatment process and of an adsorption and desorption treatment process of an introduced gas on an object face to be treated is executed continuously. CONSTITUTION:At a posterior treatment, an ashing treatment process to remove a resist is first executed in a treatment chamber 60. Then, a gas (a purer component gas) is supplied into the treatment chamber 60 by using a supply means of a gas for adsorption and desorption treatment use; a pressure control valve 80 to control a pressure inside the treatment chamber 60 is shut; the pressure inside the treatment chamber is increased. Then, when a preset pressure inside the treatment chamber is reached, a supply of the gas for adsorption and desorption treatment use is stopped and the pressure control valve 80 is opened fully. When said operations are executed, a component which has adhered to sidewalls on the surface of an object to be treated is evaporated, adsorbed and desorbed progressively. As a result, a halogen component which has adhered to the object to be treated can be reduced sharply. As a result, a corrosion-resistant performance of an Al-based interconnection film or a laminated structure interconnection film can be increased.
机译:目的:通过以下方法提高Al基互连膜和叠层结构互连膜的耐腐蚀性能:在对Al基互连膜和叠层互连膜进行干法蚀刻处理之后,进行后处理连续执行由灰化处理过程和引入的气体在待处理物体表面上的吸附和解吸处理过程组成的过程。组成:在后处理中,首先在处理室60中执行灰化处理工艺以去除抗蚀剂。然后,通过使用气体供应装置将气体(较纯的成分气体)供应到处理室60中吸附和解吸处理用途;关闭用于控制处理室60内的压力的压力控制阀80。处理室内的压力增加。然后,当达到处理室内的预设压力时,停止提供用于吸附和解吸处理的气体,并且压力控制阀80完全打开。当执行所述操作时,已经粘附到待处理物体表面上的侧壁上的部件逐渐蒸发,吸附和解吸。结果,可以急剧地减少附着在被处理物上的卤素成分。结果,可以提高Al基互连膜或层压结构互连膜的耐腐蚀性能。

著录项

  • 公开/公告号JPH03147321A

    专利类型

  • 公开/公告日1991-06-24

    原文格式PDF

  • 申请/专利权人 HITACHI LTD;

    申请/专利号JP19890284711

  • 发明设计人 SATO HITOAKI;TORII ZENZO;FUKUYAMA RYOJI;

    申请日1989-11-02

  • 分类号C23F4/00;H01L21/302;H01L21/3065;H01L21/3205;H01L21/3213;H01L23/52;

  • 国家 JP

  • 入库时间 2022-08-22 06:05:43

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