首页> 外国专利> REPELLENCY PREVENTIVE SOLUTION FOR SILVER PLATING OR SILVER PLATING SOLUTION

REPELLENCY PREVENTIVE SOLUTION FOR SILVER PLATING OR SILVER PLATING SOLUTION

机译:镀银解决方案或镀银解决方案

摘要

PURPOSE:To prevent a silver plating soln. from being repelled by a copper material and to obtain a good silver plating at the time of using a substitution preventive agent in the plating of a copper material with silver by pretreating the copper material with a soln. having a specified content of an amino compd. having a pyridine skeleton, etc. CONSTITUTION:When copper or a copper alloy is plated with silver, a substitution preventive agent such as 2-mercaptobenzthiazole is preferably used to prevent the deposition of silver by substitution. However, the surface of the copper material is repellent when the agent is used. Accordingly, a repellency preventive soln. contg. an amino compd. (2-aminopyridine, etc.,) having pyridine, pyrimidine, pyrrolidine and piperazine skeletons by 0.1-100g/l in the case of solid and 0.1-100ml/l in the case of liq. is used to pretreat the copper material. Consequently, the copper material is excellently plated with silver.
机译:用途:防止镀银。在用银对铜材料进行镀覆之前,在用银对铜材料进行镀覆的过程中使用防置换剂时,可以防止铜被铜材料排斥并获得良好的镀银。具有指定含量的氨基化合物。组成:具有吡啶骨架等。组成:在铜或铜合金上镀银时,最好使用诸如2-巯基苯并噻唑的取代防止剂来防止通过取代而沉积银。然而,当使用该试剂时,铜材料的表面是排斥的。因此,提供了一种防驱液。续氨基化合物。 (2-氨基吡啶等)具有吡啶,嘧啶,吡咯烷和哌嗪骨架的固体为0.1-100g / l,液体为0.1-100ml / l。用于预处理铜材料。因此,铜材料极好地镀有银。

著录项

  • 公开/公告号JPH03232991A

    专利类型

  • 公开/公告日1991-10-16

    原文格式PDF

  • 申请/专利权人 SHINKO ELECTRIC IND CO LTD;

    申请/专利号JP19900026785

  • 发明设计人 WAKABAYASHI SHINICHI;TAKEUCHI MASAKO;

    申请日1990-02-06

  • 分类号C25D3/46;C25D5/34;

  • 国家 JP

  • 入库时间 2022-08-22 06:05:29

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