DETECTION OF PICK UP MISTAKE BY MOUNT HEAD

摘要

PURPOSE:To prevent lowering of yield of a die bonding process by locating an emission-side sensor to a collet and a photosensitive sensor to a member which is movable together with a mount head and by moving the photosensitive sensor following movement of the collet which attracts a semiconductor pellet. CONSTITUTION:An emission-side sensor 4 is provided inside a collet 3. A mechanism to transfer a lead frame is provided with a slider 8 which is slidable along the transfer direction and movable together with a mount, wherein a photosensitive-side sensor 13 is provided. Since the slider 8 is fixed to a lever 5 which is attached to the mount head and located across the transfer mechanism, and has a structure to allow both to move integrally, the photosensitive- side sensor 13 can follow a movement of the collet 3. Thereby, it is possible to improve not only index but also yield of a die bonding process.