HIGH PERFORMANCE COVER LAY AND BOND-PLY ADHESIVE AGENT HAVING THERMAL ACTIVATION TYPE HARDENING MECHANISM BASED ON EPOXY

摘要

PURPOSE: To obtain an improved material that can be used for bonding electronic circuit materials by subjecting an aziridine component and a polyester component to a first reaction between them and then subjecting the obtained aziridine/polyester component and an epoxy component to a second reaction between them. ;CONSTITUTION: An aziridine component is reacted with one or more polyester compounds (first reaction step). The aziridine/polyester component obtained in the first reaction step is reacted with one or more trismethanenovolac-epoxy components (second reaction step). One of the above epoxy components is an electronic grade resin, such as a trismethanenovolac-epoxy component, the temperature in the above second reaction is required to be as high as 250 to 400 °F, and thus an improved adhesive that can be used for bonding electronic circuit materials can be obtained. Further, the intermediate bonding material obtained in the first reaction step can be stored for a long period of time without deteriorating the properties.;COPYRIGHT: (C)1991,JPO