首页> 外国专利> METHOD FOR WORKING LIGHT INCIDENT AND EXIT END FACE OF ELEMENT HAVING OPTICAL WAVEGUIDE AND ELEMENT HAVING OPTICAL WAVEGUIDE

METHOD FOR WORKING LIGHT INCIDENT AND EXIT END FACE OF ELEMENT HAVING OPTICAL WAVEGUIDE AND ELEMENT HAVING OPTICAL WAVEGUIDE

机译:具有光波导的元件的光入射和出射端面的工作方法和具有光波导的元件的光入射和出射端面的工作方法

摘要

PURPOSE:To improve productivity by lancing a substrate in conformity with the cleavage plane direction of the crystal body of a thin org. film from the rear surface of the substrate and forming the smooth surfaces for light incidence and emission on an optical waveguide simultaneously with cutting of the substrate. CONSTITUTION:The direction of the cleavage plane direction of 4'-nitrobenzylidene-3- acetoamino-4-methoxyaniline is observed by a polarizing microscope and thereafter, a mark 3 parallel with the cleavage plane is put on the substrate 1. The substrate 1 is then lanced 4 to 1.95mm depth along the line to be cut from the back surface of the substrate 1 by using a dicing saw while the substrate 1 is pulled to both sides, load is applied toward the lancing 4 from the upper surface of the substrate 1, by which the substrate 1 is cut and the org. crystal body 7 is cloven. The end faces effective for light incidence and emission are thus formed. The shape of the light incident and exit end faces of the org. crystal body is obtd. simultaneously with the cutting of the substrate in such a manner and, therefore, the productivity is extremely good.
机译:目的:通过按照薄组织的晶体的分裂面方向切缝底物来提高生产率。从基板的后表面形成薄膜,并形成光滑的表面,以便在切割基板的同时将光入射并发射到光波导上。组成:通过偏光显微镜观察4'-硝基亚苄基-3-乙酰氨基-4-甲氧基苯胺的裂解平面方向,然后在基板1上放置与裂解平面平行的标记3。然后,在将基板1向两侧拉出的同时,使用划片机沿切割线从基板1的背面切入4至1.95mm的深度,从基板的上表面向切缝4施加负荷参照图1,切割基片1和组织。晶体7是丁香状的。由此形成对光的入射和发射有效的端面。组织的光入射和出射端面的形状。晶体是钝的。以这种方式在切割基板的同时,因此,生产率非常好。

著录项

  • 公开/公告号JPH0337602A

    专利类型

  • 公开/公告日1991-02-19

    原文格式PDF

  • 申请/专利权人 TORAY IND INC;

    申请/专利号JP19890173646

  • 发明设计人 KONDO TOSHIYUKI;MATAGI HIROYUKI;

    申请日1989-07-04

  • 分类号G02B6/13;G02B6/12;

  • 国家 JP

  • 入库时间 2022-08-22 06:01:47

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