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LOWLY ELASTIC AND LOWLY THERMALLY EXPANDABLE RESIN COMPOSITION

机译:低弹性和低热膨胀性树脂组成

摘要

PURPOSE:To prepare the title compsn. excellent in the heat resistance, flexibility, and adhesive properties by compounding a polyimide resin and another resin as essential components, each resin having specified physical properties, and by giving the compd. a phase-separation structure. CONSTITUTION:95-20 pts.wt. polyimide resin with a coefficient of linear expansion of 3.0X10-5/K or lower comprising a polyamideimide resin contg. the structural unit of formula I (wherein R1 to R8 are each H, halogen, lower alkyl, or lower alkoxy, and at least one or R3 to R6 is lower alkoxy; and Ar1 is a group of formula II or III) or a polyimide resin contg. the structural unit of formula IV (wherein R9 to R12 are each R1, nitro, or nitrile) and 5-80 pts.wt. resin with an elastic modulus of 100kg/mm2 or lower pref. comprising a linear satd. polyester resin are compounded as essential components, and the compd. is given a phase-separation structure.
机译:目的:准备标题书。通过将聚酰亚胺树脂和另一种树脂作为基本成分进行配混,使每种树脂具有特定的物理性能,并赋予其致密性,从而具有优异的耐热性,柔韧性和粘合性。相分离结构。组成:95-20pts.wt。线膨胀系数为3.0×10 -5 / K以下的聚酰亚胺树脂,其特征在于,含有聚酰胺酰亚胺树脂。式I的结构单元(其中R 1至R 8各自为H,卤素,低级烷基或低级烷氧基,并且至少一个或R 3至R 6为低级烷氧基;且Ar 1为式II或III的基团)或聚酰亚胺树脂续式IV的结构单元(其中R 9至R 12各自为R 1,硝基或腈)和5-80pts.wt。弹性模量为100kg / mm 2或更低的树脂。包括线性饱和混合聚酯树脂作为必需成分,并制成复合物。给出了相分离结构。

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