COMPOSITE DIELECTRIC STRUCTURE FOR OPTIMIZING ELECTRICAL PERFORMANCE IN HIGHPERFORMANCE CHIP SUPPORT PACKAGES

摘要

ABSTRACT OF THE DISCLOSUREThe disclosure describes a technique whereby theelectrical characteristics of an electrical circuit in apackage may be adjusted to a predetermined value bychanges in the dielectric structure between two levels ofcircuitry. This adjustment in the composite dielectricstructure is accomplished by changes in the electricalproperties of the composite dielectric material, one levelbeing preset to a value and the other level being adjustedby alterations of predetermined amounts that depend uponthe performance desired.