METHOD OF OPTIMIZING A CONDUCTOR-PATH LAYOUT FOR THE PRINTING HEAD OF AN INK PRINTING DEVICE, AND A CONDUCTOR-PATH LAYOUT FOR SUCHA PRINTING HEAD

摘要

Through a suitable dimensioning of a transition structure (UV) of a configuration of conductor patterns provided on a thin film substrate (DS) connecting the plotted closely spaced conductors between them (LA) in the heating elements of the area (HR) to conductive traces having a broad gap between them (LB) in the connecting contact area is obtained a conductive tracings feed resistor (Li) which is as uniform as possible, while remaining as small as possible for all heating elements (RH). To this end, it is provided a design limitation that, for predetermined input variables, namely, the widths of conductive traces (da, db) and the gap widths (Sa, Sb) in both zones and slit width (Sv) of the transition structure (UV), provides as output variables, the width of conductors (dv) in the transition structure (UV).