Amino phenyl containing curing agent for high performance phthalonitrile resin

摘要

High temperature polymeric materials, which are easily process into void-free components, are needed for use in composites for advanced aerospace applications. These materials could bridge the gap between currently-used polymeric materials and ceramics or metal. Phthalonitrile resins can be used as high temperature polymeric material and 1,3-bis(3- aminophenoxy)benzene can be used as a curing agent to reduce voids and benzene can be used as a curing agent to reduce voids and blisters formed from volatiles during polymerization.