NEW HIGH-PERFORMANCE RESIN, EPOXY RESIN COMPOSITION, AND ITS CURED ARTICLE

摘要

PURPOSE:To prepare a resin giving a resin compsn. which gives a cured article exhibiting a high heat resistance, a low water absorption, and excellent adhesive properties by condensing naphthol with p-xylylene glycol. CONSTITUTION:Naphthol (1- or 2-naphthol) is condensed with p-xylylene glycol in the presence of an acid catalyst (e.g. hydrochloric, sulfuric, oxalic, or p- toluenesulfonic acid) to give a resin of formula I, which is allowed to react with an epihalohydrin in the presence of a basic compd. to give a resin of formula II. By compounding an epoxy resin with the resin of formula I as a curative, by compounding the resin of formula II as an epoxy resin with a curative, or by compounding the resin of formula II as an epoxy resin with the resin of formula I as a curative, an epoxy resin compsn. is prepd. The compsn. gives a cured article exhibiting a high heat resistance, a low water absorption, and excellent adhesive properties and is used, e.g. for sealing electronic parts.