首页> 外国专利> BONDING METHOD FOR FIBER REINFORCED PLASTIC BASE OR ENGINEERING PLASTIC BASE

BONDING METHOD FOR FIBER REINFORCED PLASTIC BASE OR ENGINEERING PLASTIC BASE

机译:纤维增强塑料基或工程塑料基的粘结方法

摘要

PURPOSE:To upgrade shearing strength by inserting a spacer into a bonding layer of a fiber reinforced plastic base, performing pressure bonding and specifying the thickness of the bonding layer after curing of a bonding adhesive. CONSTITUTION:When an FRP base or an engineering plastic base is bonded with a bonding adhesive, a spacer is inserted into a bonding layer, pressure bonding is performed and the thickness of the adhered layer after curing the adhesive agent is made in the range of 0.05mm-0.3mm to obtain the maximum shearing strength. In that case, as resin as a main component of the bonding adhesive, for example, bisphenol A type epoxy resin, is used and as a curing agent, modified polyamideamine is used, and the adding quantity of glass beads as a spacer is, for example, 10:1 weight ratio to the bonding adhesive. A glass bead layer is formed into one layer by the process. However, in the case that the grain diameter of glass beads is small, the weight ratio is made 100:1 to form one layer of glass beads.
机译:目的:通过在纤维增强塑料基体的粘结层中插入垫片,提高压力强度,并在粘结胶固化后指定粘结层的厚度,以提高剪切强度。组成:用粘合剂将FRP基体或工程塑料基体粘合时,将垫片插入粘合层,进行压力粘合,使粘合剂固化后的粘合层厚度在0.05范围内mm-0.3mm以获得最大的剪切强度。在这种情况下,作为树脂,作为粘接剂的主要成分,例如使用双酚A型环氧树脂,作为固化剂,使用改性聚酰胺胺,作为间隔物的玻璃珠的添加量如下。例如,与粘合剂的重量比为10:1。通过该方法将玻璃珠层形成为一层。然而,在玻璃珠的粒径小的情况下,使重量比为100:1以形成一层玻璃珠。

著录项

  • 公开/公告号JPH04122625A

    专利类型

  • 公开/公告日1992-04-23

    原文格式PDF

  • 申请/专利权人 RAILWAY TECHNICAL RES INST;

    申请/专利号JP19900241303

  • 发明设计人 MURATA HITOSHI;

    申请日1990-09-13

  • 分类号B29C65/54;B29C65/00;B29C65/48;B29K105/06;B29L31/30;

  • 国家 JP

  • 入库时间 2022-08-22 05:41:57

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