OLIGOMER AND POLYMER OF DIACETYLENE AMIDE CONTAINING DOUBLE BOND

摘要

PURPOSE:To provide a composition containing diacetylene group and C-C double bond, having excellent moldability and curability, giving a crosslinked molded article having high heat-resistance and useful as electronic material and aerospace material. CONSTITUTION:A diacetylene amide oligomer or polymer composed of (A) a constituent unit consisting of one or more hydrocarbon group containing diacetylene group and expressed by formula I or II (R is H or univalent organic group; R1-R3 are bivalent organic group) and (B) a constituent unit consisting of one or more diamide group containing C-C double bond and expressed by formula III (X1 and X2 are amido; R4 is bivalent organic group containing C-C double bond) wherein said constituent units A and B are bonded together via X1 or X2. The ratio of the groups of formula I-III is selected to satisfy the formula 0.2=III/(I+II)=5.