INTERDIGITATED TRANS-DIE LEAD CONSTRUCTION AND METHOD OF CONSTRUCTION FOR MAXIMIZING POPULATION DENSITY OF CHIP-ON-BOARD CONSTRUCTION

摘要

A novel implementation of a tape automated bonding process of attaching leads (44) to a semiconductor die (50) is disclosed which utilizes a method of attaching tape leads which extend across the interior surface of the die (50) rather than radially outwardly from the die (50). Two-layer or three-layer tape construction is used, with the insulation (30A) being located between the top of the die (50) and the leads (44). This technique enables lead placement on opposite sides of the die (50) in interdigitated fashion, allowing die (50) to be installed on a circuit board (70) more closely adjacent than has previously been possible.