Temp. measuring system for cooled electronic component - has temp. sensor pref. on polyimide sensor foil

摘要

A temp. measuring arrangement for electronic components (6), which are cooled by contact with a coolant, comprises (a) a temp. sensor (5), mounted on the contact face between the component (6) and the coolant and accommodated in a recess in the coolant (pref. a heat sink plate, 1); and (b) thermal insulation between the sensor (5) and the coolant. Pref. the sensor is a thin film, temp.-dependent resistive sensor (5) provided on a sensor foil (4) of polyimide. ADVANTAGE - Reliable, accurate temp. measurements are obtd. with insignificant effect on component cooling.