Circuit arrangement for measuring a mechanical deformation, in particular under the influence of a pressure

摘要

A circuit arrangement for measuring a mechanical deformation includes a pressure sensor with compression-deformable resistors for generating an analog deformation-dependent signal and a circuit for evaluating the analog deformation-dependent signal. The evaluating circuit includes a summing amplifier and a temperature-dependent coupling resistor connected between the input of the summing amplifier and the pressure sensor. The coupling resistor has a temperature coefficient adjusted to compensate for the temperature characteristic of the measuring sensitivity of the analog deformation-dependent signal. A temperature sensor generates a temperature-dependent signal corresponding to a static temperature characteristic of the evaluating circuit. There is provided a circuit for applying the temperature-dependent signal to the input of the summing amplifier to combine it with the analog deformation-dependent signal. The summing amplifier generates at its output a temperature-compensated, deformation-dependent output signal.