METHOD FOR MEASURING BONDING STRENGTH OF RESIN LAYER

摘要

PURPOSE:To stably measure the bonding strength of a resin layer, by a method wherein a release tool, wherein chamfering was applied to the edge thereof almost extending to the surface of a base material in a dimension smaller than the thickness of the resin layer, is pressed to the resin layer and moved in parallel to the surface of the base material. CONSTITUTION:A release tool 48, wherein chamfering of a dimension smaller than the thickness of a resin layer 52 was applied to the edge thereof being in the surface side almost at right angles to the surface of a base material 54 and almost extending along the surface of said base material 5, is pressed to the resin layer 52 and moved in parallel to the surface of the base material 54. The magnitude of resistance force, generated when the resin layer 2 is released from the base material 54, is measured. That is, a tool holder 46 is downwardly pressed by an Amsler testing machine to allow the release tool 48 to move along the surface of a rotor main body 54 at a constant speed and the release resistance force of the resin layer 52 is measured while the resin layer 52 is released and, by recording apparatus, the bonding strength of the resin layer can be stably measured.