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HEAT SINK COOLING FAN EXCELLENT IN HEAT RADIATION PROPERTY, AND ITS MANUFACTURE

机译:散热性能优异的散热片冷却风扇及其制造

摘要

PURPOSE: To improve heat radiation performance by constituting a heat sink out of a bottom plate and a hollow projection standing erect on the bottom plate and united with the bottom plate, and forming the peripheral wall of the hollow projection out of a plurality of parallel plate-type fins standing erect on the bottom plate or pin-type fins. ;CONSTITUTION: For a heat sink 35, a bottom plate 31 consisting of a good heat conductor, and thereon, an erect hollow projection 36 having a hollow area 32, in short, a hollow section, and, surrounding this hollow region 32, a hollow projection 36 are made. The peripheral wall of the hollow projection is constituted of a row of heat radiation fins 34 made of a good heat conductor erect on the bottom plate 31. The heat radiation fins 34 in a row are constituted of a plurality of unit fin elements 33. The heat generated by a chip is conducted to the heat radiation fins 34 in a row through the bottom plate 31 of the heat sink 35 by heat conduction. On the other hand, cool air for cooling is supplied to the hollow area 32 of the fins in a row through the opening 42 at the center of a top board, and then it takes the heat off from the heat radiation fins 34 in a row.;COPYRIGHT: (C)1993,JPO&Japio
机译:用途:通过以下方式来提高散热性能:在底板上构成散热片,并竖立在底板上并与底板结合在一起的中空突起,并由多个平行板形成中空突起的周壁型鳍竖立在底板上或销形鳍上。组成:对于散热器35,由良好导热性组成的底板31,其上是直立的中空突起36,其具有中空区域32(简而言之,中空部分),并且围绕该中空区域32,制成空心突起36。中空突起的周壁由竖立在底板31上的由良好的导热性制成的一排散热片34构成。成排的散热片34由多个单元散热片元件33构成。由芯片产生的热量通过热传导穿过散热器35的底板31连续地传导到散热片34。另一方面,用于冷却的冷空气通过顶板中心处的开口42连续地供应到散热片的中空区域32,然后将热量从散热片34连续地带走。 。;版权:(C)1993,JPO&Japio

著录项

  • 公开/公告号JPH05283878A

    专利类型

  • 公开/公告日1993-10-29

    原文格式PDF

  • 申请/专利权人 SUMITOMO METAL IND LTD;

    申请/专利号JP19920074652

  • 申请日1992-03-30

  • 分类号H05K7/20;B24B27/06;H01L23/36;H01L23/467;

  • 国家 JP

  • 入库时间 2022-08-22 05:18:34

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