首页> 外国专利> CONFORMAL CIRCUIT FOR STRUCTURAL HEALTH MONITORING AND ASSESSMENT

CONFORMAL CIRCUIT FOR STRUCTURAL HEALTH MONITORING AND ASSESSMENT

机译:用于结构健康监测和评估的保形电路

摘要

A strain, crack and acoustic emission conformal structural health monitoring circuit with integral preprocessor and provisions for connectorization to a central processing system includes a strain gauge (11) having crack sensing traces (21), (23), and (25) sandwiched between a bottom layer (13) and a top layer (39). Strain gauge (11) is attached to an aircraft structural surface (51) to be monitored. Successive alternating layers of interconnecting sheet layers (61) and dielectric layers (63) joined by successive layers of non-structural adhesive (65) are added sufficient to effectively attenuate any stress forces, and forces directly from the strain and cracks, from traveling upward from the aircraft structural surface (51). A metalization layer (47) tops the successive layers and supports an integrated circuit (43) which may be multi-chip hybrid package, discretely packaged components or conformally coated chip/circuit assemblies, and provides a means of interconnect to and protection from the ambient environment.
机译:具有整体预处理器和用于连接到中央处理系统的装置的应变,裂纹和声发射保形结构健康监测电路,包括应变仪(11),其具有夹在中间的裂纹感应迹线(21),(23)和(25)。底层(13)和顶层(39)。应变仪(11)附接到要监测的飞机结构表面(51)。互连片层(61)和介电层(63)的连续交替层由连续的非结构性粘合剂(65)层连接在一起,足以有效地减弱任何应力,以及直接来自应变和裂纹的力向上传播从飞机结构表面(51)。金属化层(47)在连续层的顶部,并支撑集成电路(43),该集成电路可以是多芯片混合封装,分立封装的组件或保形涂覆的芯片/电路组件,并提供与周围环境互连和保护的手段环境。

著录项

  • 公开/公告号IL102701D0

    专利类型

  • 公开/公告日1993-01-14

    原文格式PDF

  • 申请/专利权人 HUGHES AIRCRAFT COMPANY;

    申请/专利号IL19920102701

  • 发明设计人

    申请日1992-07-31

  • 分类号G01N;

  • 国家 IL

  • 入库时间 2022-08-22 05:11:27

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