首页> 外国专利> TREATMENT OF SULPHURIC ACID SOLUTIONS CONTAINING TELLURIUM, COPPER SULPHATE AND MINOR IMPURITY ELEMENTS

TREATMENT OF SULPHURIC ACID SOLUTIONS CONTAINING TELLURIUM, COPPER SULPHATE AND MINOR IMPURITY ELEMENTS

机译:含碲,硫酸铜和微量杂质元素的硫酸溶液的处理

摘要

-12-Abstract of the Disclosure:A process for the treatment of a sulphuric acidsolution containing tellurium, copper sulphate, and minorimpurity elements is disclosed. The process comprises thesteps of recirculating the sulphuric acid solution betweena first tank containing such solution and a second reactortank containing a bed of copper particles for a timeinterval sufficient to cement substantially all thetellurium present in the leach liquor as copper telluride,adding oxygen to the first and/or second tank to form acopper sulphate solution during recirculation of thesulphuric acid solution between the first and secondtanks, and separating the cemented copper telluride fromthe copper sulphate solution.
机译:-12-披露摘要:处理硫酸的方法含碲,硫酸铜和微量的溶液公开了杂质元素。该过程包括循环硫酸溶液之间的步骤装有这种溶液的第一罐和第二反应器装有一段时间的铜颗粒床的水箱足以巩固所有浸出液中的碲以碲化铜的形式存在,向第一罐和/或第二罐添加氧气以形成循环过程中的硫酸铜溶液第一和第二之间的硫酸溶液罐,并从中分离胶结的碲化铜硫酸铜溶液。

著录项

  • 公开/公告号CA1319826C

    专利类型

  • 公开/公告日1993-07-06

    原文格式PDF

  • 申请/专利权人 NORANDA INC.;

    申请/专利号CA19860520041

  • 发明设计人 MORRISON BERNARD H.;

    申请日1986-10-07

  • 分类号C22B3/00;C22B3/20;

  • 国家 CA

  • 入库时间 2022-08-22 05:08:48

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