A series of polyoxyalkylene diamines modified with phenoxy groups is disclosed. This series of diamines is of the general formula: wherein R₁ and R₂ are independently hydrogen or an alkyl of 1 to 4 carbon atoms, R₃ is a alkyl of 1 to 4 carbon atoms, Ph is phenyl, x ranges from 2 to 40, y ranges from 1 to 20 and z ranges from 1 to 40.;These diamines are cured with liquid epoxy resins. The cured resins demonstrated improved tensile strength and modulus, elongation and flexural strength and modulus over a commercially used curative.;The diamines are also useful in RIM elastomers, in polyamides and as chain extenders in polyurethane foams.
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