PROCESS FOR PASSIVATING ANODIZATION OF COPPER IN A MOLTEN FLUORIDE MEDIUM, AND APPLICATION TO THE PROTECTION OF COPPER PARTS OF FLUORINE ELECTROLYZERS

摘要

PCT No. PCT/FR88/00334 Sec. 371 Date Feb. 23, 1989 Sec. 102(e) Date Feb. 23, 1989 PCT Filed Jun. 23, 1988 PCT Pub. No. WO88/10328 PCT Pub. Date Dec. 29, 1988.A process for producing a strong, adherent protective layer on copper parts, with a high rate of covering of the substrate, by passivating anodization, characterized in that the copper parts are immersed in a liquid KF, 2HF bath and subjected to anodic current of low surface-related density which is less than 0.1 A/dm2, which current may be continuous or intermittent.