METHOD OF MANUFACTURE OF LOW-FREQUENCY AMPLITUDE LATTICES AND DIAMOND TOOL FOR CUTTING THEM

摘要

the essence of the u0438u0437u043eu0431u0440u0435u0442u0435u043du0438u00a0: u043du0430u043du043eu0441u00a0u0442 layer u0430u043bu044eu043cu0438u043du0438u00a0 on u0441u0442u0435u043au043bu00a0u043du043du0443u044e substrate and for u043cu0438u0440u0443u044eu0442 it touches the diamond u0431u0438u0446u0438u043bu0438u043du0434u0440u0438u0447u0435u0441u043au0438u043c wiener additional flat edge and p u043eu0441u043bu0435u0434u0443u044eu0449u0438u043c u043fu0440u043eu0442u0440u0430u0432u043bu0438u0432u0430u043du0438u0435u043c strokes.spread used in the direction opposite to the direction u043fu0435u0440u0435u043cu0435u0449u0435u043du0438u00a0 billets bars on the corner u043eu043fu0440u0435u0434u0435u043bu00a0u0435u043cu044bu0439 ratio arcsln p 2k (d -------- t where d is the u043fu043eu0441u0442u043eu00a0u043du043du0430u00a0 (r r (tga) 1 / 2 u0440u0435u0437u0430u0435u043cu043eu0439 lattice; to do transparent section bars to its u043fu043eu0441u0442u043eu00a0u043du043du043eu0439; r - chi - rina additional edge incisors: p angle of grinding lateral incisors; r the radius of curvature u043bu0435u0437u0432u0438u00a0 incisors.the radius of curvature u043bu0435u0437u0432u0438u00a0 incisors u0441u043eu0441u0442u0430u0432u043bu00a0u0435u0442 1.3 1.7 mm, and the width of the additional flat edge u0441u043eu0441u0442u0430u0432u043bu00a0u0435u0442 0000.5-00009 mm. 2 boeing. s - lu, 5 u0438u043b., 2 table. yu