首页> 外国专利> Thermoplastic polymer mixts. with improved processability, etc. - contains cyclic organo-silicon cpd., pref. octa:phenyl-cyclo:tetra:siloxane, as solid, anticorrosive processing additive, etc.

Thermoplastic polymer mixts. with improved processability, etc. - contains cyclic organo-silicon cpd., pref. octa:phenyl-cyclo:tetra:siloxane, as solid, anticorrosive processing additive, etc.

机译:热塑性聚合物混合物。具有改进的可加工性等。-包含环状有机硅cpd。,优选。八:苯基-环:四:硅氧烷,作为固体,防腐加工助剂等

摘要

Mixts. of thermoplastic polymers and organosilicon cpds. (I), contg. at least one cyclic organo-Si cpd. of formula (II) in amts. of 0.01-5wt.% w.r.t. polymer. In (II), R1, R2 are alkyl or aryl; n is 3-10. Pref. (II) is octaphenyl cyclotetrasiloxane (IIA) in amts. of 0.1-1wt.%; (I) also contain fillers, reinforcing agents and/or pigments. USE/ADVANTAGE - (I) are useful for the prodn. of electronic components and in the food industry (claimed). The invention provides new processing additives (II) for thermoplastics, which are colourless, harmless, pref. solid at room temp., anticorrosive and easily metered (contrast prior-art silicone additives); (II) improve the distribution of components in polymer mixts. (resulting in improved mechanical and flow properties, etc.), and act as effective mould release agents; (II) are esp. useful in processing high temp.-resistant polymers such as PPO, PEEK, PPS polyarylate, etc..
机译:混音。热塑性聚合物和有机硅的cpds。 (I),续至少一种环状有机硅cpd。式中的式(II)的量。重量的0.01-5wt。%聚合物。在(II)中,R 1,R 2为烷基或芳基; n为3-10。首选(II)是八角环中的八苯基环四硅氧烷(IIA)。 0.1-1wt。%; (I)还包含填料,增强剂和/或颜料。使用/优势-(I)对产品有用。电子零件和食品工业的生产(已声明)。本发明提供了无色,无害,优选的用于热塑性塑料的新的加工添加剂(II)。在室温下为固体,耐腐蚀且易于计量(与现有技术的有机硅添加剂相比); (II)改善聚合物混合物中组分的分布。 (导致改善的机械性能和流动性能等),并充当有效的脱模剂; (II)是。可用于加工耐高温聚合物,如PPO,PEEK,PPS聚芳酯等。

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