首页> 外国专利> Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove

Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove

机译:交叉切割半导体光波导带-使用线性底部支撑和上压力板,将弹簧加载的切割楔安装到蚀刻的分离槽中

摘要

The continuous semiconductor strip with germanium strips diffused into one surface is cut to length to form an optical waveguide. Across the other surface, transverse V-shaped grooves (19) form the cutting points. To make a cross cut, the strip (1) is placed above a supporting plate (23) across which is a round section rubber member (25) forming a linear support in line with the cutting groove. A pressure plate (26) with a spring loaded cutting edge (28) is then used to make the cut. The cutting groove, made by anisotropic etching, is about 30 percent of the thickness of the strip. Two woven material tubes (35,36), one each side of the wedge between the pressure plate and strip form a symmetrical support. ADVANTAGE - Cross cuts are of optimum quality to reduce diffuse back scatter of light.
机译:将具有扩散到一个表面中的锗带的连续半导体带切成一定长度,以形成光波导。在另一个表面上,横向的V形凹槽(19)形成了切割点。为了进行横切,将条带(1)放置在支撑板(23)上方,在支撑板(23)上是圆形截面橡胶构件(25),该圆形截面橡胶构件形成与切割槽成一直线的线性支撑。然后使用带有弹簧加载的切削刃(28)的压板(26)进行切削。通过各向异性蚀刻制成的切割槽约为带钢厚度的30%。两个编织材料管(35,36),在压板和压条之间的楔形件的每一侧各形成一个对称的支撑。优势-横切具有最佳质量,可减少光的向后散射。

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