首页>
外国专利>
Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove
Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove
展开▼
机译:交叉切割半导体光波导带-使用线性底部支撑和上压力板,将弹簧加载的切割楔安装到蚀刻的分离槽中
展开▼
页面导航
摘要
著录项
相似文献
摘要
The continuous semiconductor strip with germanium strips diffused into one surface is cut to length to form an optical waveguide. Across the other surface, transverse V-shaped grooves (19) form the cutting points. To make a cross cut, the strip (1) is placed above a supporting plate (23) across which is a round section rubber member (25) forming a linear support in line with the cutting groove. A pressure plate (26) with a spring loaded cutting edge (28) is then used to make the cut. The cutting groove, made by anisotropic etching, is about 30 percent of the thickness of the strip. Two woven material tubes (35,36), one each side of the wedge between the pressure plate and strip form a symmetrical support. ADVANTAGE - Cross cuts are of optimum quality to reduce diffuse back scatter of light.
展开▼