Low-molecular wt. polyphenylene ether moulding materials - including impact-modified vinyl aromatic polymer contg. soft component with D50 at least 3-5 microns

摘要

Thermoplastic moulding materials (I) are claimed, contg. (A) 5-90 wt.% polyphenylene ether with Mw 800-30,000, (B) 5-90 wt.% impact-modified vinylaromatic polymer contg. 20-50 wt.% soft component with mean particle size at least 3.5 microns, and (C) 0-60 wt.% normal additives and processing aids. (A) has Mw 12,000-25,000 and (B) contains 25-40 wt.% soft component. Pref. (A) is poly-(2,6-dimethyl- 1,4-phenylene ether) (PPE) or a homologue thereof. (B) is high-impact polystyrene (HIPS) contg. 5-15 wt.% rubber, e.g. polybutadiene, polyisoprene, etc., (C) can be different impact modifiers, fire retardants, pigments, etc. USE/ADVANTAGE - Used for the prodn. of fibres, film and moulded prods. (claimed). The invention provides thermoplastic HIPS/PPE moulding materials with good thermal dimensional stability and good stress cracking resistance, combined with good multiaxial impact strength which is relatively unaffected by repeated processing.